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Více informací o knize Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture

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Anotace knihy

The reliability of components is a prime concern to electronics manufacturers and the failure of microelectronic packaging is a major source of component faults. Failure of electronic packaging: Effects of temperature, moisture and mechanical driving forces provides a thorough review of this important field of research. This practical guide discusses theoretical aspects, experimental results, modeling techniques and results. The authors have used their extensive experience to produce detailed chapters covering temperature, moisture and mechanical shock induced failure in addition to adhesive interconnects and viscoelasticity. Useful program files and macros are included.

Parametry knihy

Zařazení knihy Knihy v angličtině Technology, engineering, agriculture Electronics & communications engineering Electronics engineering

• Plný název: Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture
• Autor: E.H. Wong, S.K. Woon, Y. W. Mai
• Jazyk: Angličtina
• Vazba: Pevná
• Počet stran: 482
• EAN: 9781845695286
• ISBN: 1845695283
• ID: 05098486
• Nakladatelství: Elsevier Science & Technology
• Hmotnost: 830 g
• Rozměry: 229 × 152 × 30 mm
• Datum vydání: 22. May 2015

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